B32671P ... B32673P
Power Factor Correction
Testing and Standards
Test
Reference
Conditions of test
Performance
requirements
Electrical
Parameters
IEC 60384-16
Voltage proof, 1.4 VR, 1 minute
Insulation resistance, RINS
Capacitance, C
Dissipation factor, tan δ
Within specified limits
Robustness of
terminations
IEC 60068-2-21
Tensile strength (test Ua1)
Wire diameter
Tensile
force
Capacitance and tan δ
within specified limits
Resistance to
soldering heat
IEC 60068-2-20,
test Tb,
method 1A
0.5 < d1 ≤ 0.8 mm 10 N
Solder bath temperature at
260 ± 5 °C, immersion for
10 seconds
∆C/C0 ≤ 2%
I∆ tan δ l ≤ 0.001
Rapid change of IEC 60384-16
temperature
TA = lower category temperature I∆C/C0 I ≤ 2%
TB = upper category temperature I∆ tan δ I ≤ 0.002
Five cycles, duration t = 30 min. RINS ≥ 50% of initial limit
Vibration
IEC 60384-16
Test FC: vibration sinusoidal
Displacement: 0.75 mm
Accleration: 98 m/s2
Frequency: 10 Hz ... 500 Hz
Test duration: 3 orthogonal axes,
No visible damage
2 hours each axe
Bump
Climatic
sequence
IEC 60384-16
IEC 60384-16
Test Eb: Total 4000 bumps with
390 m/s2 mounted on PCB
6 ms duration
Dry heat Tb / 16 h.
Damp heat cyclic, 1st cycle
+ 55 °C / 24h / 95% ... 100% RH
Cold Ta / 2h
Damp heat cyclic, 5 cycles
+ 55 °C / 24h / 95% ... 100% rh
No visible damage
I∆C/C0 I ≤ 2%
I∆ tan δ I ≤ 0.001
RINS ≥ 50% of initial limit
No visible damage
I∆C/C0 I ≤ 2%
I∆ tan δ I ≤ 0.001
RINS ≥ 50% of initial limit
Damp Heat
Steady State
High
temperature
high humidity
with load
IEC 60384-16
Test Ca
No visible damage
40 °C / 93% RH / 56 days
I∆C/C0 I ≤ 3%
I∆ tan δ I ≤ 0.003
RINS ≥ 50% of initial limit
60 °C / 95% RH / 1000 hours with No visible damage
VR, DC
I∆C/C0 I ≤ 10%
I∆ tan δ I ≤ 0.004
RINS ≥ 50% of initial limit
Please read Cautions and warnings and
Important notes at the end of this document.
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