MMPQ3725 查看數據表（PDF） - ON Semiconductor

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MMPQ3725

Quad Core Driver Transistor

ON Semiconductor 

MMPQ3725

INFORMATION FOR USING THE SO−16 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor packages must

be the correct size to insure proper solder connection

interface between the board and the package. With the

correct pad geometry, the packages will self align when

subjected to a solder reflow process.

0.060

1.52

0.275

7.0

0.155

4.0

0.024

0.6

0.050

1.270

inches

mm

SO−16

SO−16 POWER DISSIPATION

The power dissipation of the SO−16 is a function of the

pad size. This can vary from the minimum pad size for

soldering to a pad size given for maximum power

dissipation. Power dissipation for a surface mount device is

determined by TJ(max), the maximum rated junction

temperature of the die, RθJA, the thermal resistance from the

device junction to ambient, and the operating temperature,

TA. Using the values provided on the data sheet for the

SO−16 package, PD can be calculated as follows:

PD =

TJ(max) − TA

RθJA

The values for the equation are found in the maximum

ratings table on the data sheet. Substituting these values into

the equation for an ambient temperature TA of 25°C, one can

calculate the power dissipation of the device which in this

case is 1.4 watts.

PD =

150°C − 25°C

89.3°C/W

= 1.4 watts

The 89.3°C/W for the SO−16 package assumes the use of

the recommended footprint on a glass epoxy printed circuit

board to achieve a power dissipation of 1.4 watts. There are

other alternatives to achieving higher power dissipation

from the SO−16 package. Another alternative would be to

use a ceramic substrate or an aluminum core board such as

Thermal Clad™. Using a board material such as Thermal

Clad, an aluminum core board, the power dissipation can be

doubled using the same footprint.

SOLDERING PRECAUTIONS

The melting temperature of solder is higher than the rated

temperature of the device. When the entire device is heated

to a high temperature, failure to complete soldering within

a short time could result in device failure. Therefore, the

following items should always be observed in order to

minimize the thermal stress to which the devices are

subjected.

• Always preheat the device.

• The delta temperature between the preheat and soldering

should be 100°C or less.*

• When preheating and soldering, the temperature of the

leads and the case must not exceed the maximum

temperature ratings as shown on the data sheet. When

using infrared heating with the reflow soldering method,

the difference shall be a maximum of 10°C.

• The soldering temperature and time shall not exceed

260°C for more than 10 seconds.

• When shifting from preheating to soldering, the maximum

temperature gradient shall be 5°C or less.

• After soldering has been completed, the device should be

allowed to cool naturally for at least three minutes.

Gradual cooling should be used as the use of forced

cooling will increase the temperature gradient and result

in latent failure due to mechanical stress.

• Mechanical stress or shock should not be applied during

cooling.

* Soldering a device without preheating can cause

excessive thermal shock and stress which can result in

damage to the device.

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