HSMS-2817-BLK 查看數據表（PDF） - HP => Agilent Technologies

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HSMS-2817-BLK

Surface Mount RF Schottky Barrier Diodes

HP => Agilent Technologies 

5

Applications Information

Introduction —

Product Selection

Agilent’s family of Schottky

products provides unique solu-

tions to many design problems.

The first step in choosing the right

product is to select the diode type.

All of the products in the

HSMS-282x family use the same

diode chip, and the same is true of

the HSMS-281x and HSMS-280x

families. Each family has a

different set of characteristics

which can be compared most

easily by consulting the SPICE

parameters in Table 1.

A review of these data shows that

the HSMS-280x family has the

highest breakdown voltage, but at

the expense of a high value of

series resistance (Rs). In applica-

tions which do not require high

voltage the HSMS-282x family,

with a lower value of series

resistance, will offer higher

current carrying capacity and

better performance. The HSMS-

281x family is a hybrid Schottky

(as is the HSMS-280x), offering

lower 1/f or flicker noise than the

HSMS-282x family.

In general, the HSMS-282x family

should be the designer’s first

choice, with the -280x family

reserved for high voltage applica-

tions and the HSMS-281x family

for low flicker noise applications.

Assembly Instructions

SOT-323 PCB Footprint

A recommended PCB pad layout

for the miniature SOT-323 (SC-70)

package is shown in Figure 6

(dimensions are in inches). This

layout provides ample allowance

for package placement by auto-

mated assembly equipment

without adding parasitics that

could impair the performance.

Table 1. Typical SPICE Parameters.

Parameter Units HSMS-280x

BV

V

CJ0

pF

EG

eV

IBV

A

IS

A

N

RS

Ω

PB (VJ)

V

PT (XTI)

M

75

1.6

0.69

1 E-5

3 E-8

1.08

30

0.65

2

0.5

HSMS-281x

25

1.1

0.69

1 E-5

4.8 E-9

1.08

10

0.65

2

0.5

HSMS-282x

15

0.7

0.69

1 E-4

2.2 E-8

1.08

6.0

0.65

2

0.5

0.026

0.07

0.035

0.016

Figure 6. PCB Pad Layout

(dimensions in inches).

Assembly Instructions

SOT-363 PCB Footprint

A recommended PCB pad layout

for the miniature SOT-363 (SC-70,

6 lead) package is shown in

Figure 7 (dimensions are in

inches). This layout provides

ample allowance for package

placement by automated assembly

equipment without adding

parasitics that could impair the

performance.

0.026

0.035

0.075

0.016

Figure 7. PCB Pad Layout

(dimensions in inches).

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