ISL8200M 查看數據表（PDF） - Renesas Electronics
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ISL8200M Datasheet PDF : 25 Pages
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ISL8200M
Ordering Information
PART NUMBER
(Notes 1, 2, 3)
PART MARKING
TEMP. RANGE
(°C)
PACKAGE
(RoHS Compliant)
PKG. DWG. #
ISL8200MIRZ
ISL8200M
-40 to +85
23 Ld QFN
L23.15x15
ISL8200MEVAL1PHZ
Evaluation Board
NOTES:
1. Add “-T” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
2. These Intersil plastic packaged products employ special material sets, molding compounds and 100% matte tin plate plus anneal (e3) termination
finish, These products do contain Pb but they are RoHs compliant by exemption 5 (Pb in piezoelectric elements). These Intersil RoHs compliant
products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL8200M. For more information on MSL please see techbrief TB363.
Pinout Internal Circuit
VIN 13
EN 12
FF 11
PGOOD 22
CLKOUT 8
PH_CNTRL 9
ISET 5
ISHARE 6
ISHARE_BUS 10
ISFETDRV 3
FSYNC_IN 7
VCC
RPG
10k
VCC
RCLK
10k
VCC
RPHC
10k
CF3
CF4
RFS
59k
VCC
PVCC
21
14
RCC
5
CF1
CF2
LDO
Internal PGOOD
PVIN
17
ISL8200M
Module
BOOT1
UGATE1 Q1
PHASE1
LGATE1 Q2
CBOOT1
LOUT1
330nH
19 VOUT
CONTROLLER
ISEN1A
ISEN1B
RISEN-IN
2.2k
COMP
FB1
ZCOMP1
VMON1
VSEN1+
VSEN1-
ZCOMP2
RCSR
CVSEN
18 PGND
16 PHASE
20 OCSET
ROS1
2.2k
1 VOUT_SET
2 VSEN_REM-
15
PGND1
4
PGND1
FN6727 Rev 2.00
June 9, 2015
Page 2 of 25
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