ISL8200AM 查看數據表（PDF） - Renesas Electronics
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ISL8200AM Datasheet PDF : 25 Pages
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ISL8200AM
Pin Descriptions (Continued)
PIN # PIN NAME
PIN DESCRIPTION
23
N.C.
Not internally connected
PD1 Phase Thermal Pad Used for both the PHASE pin (Pin 16) and for heat removal connecting to heat dissipation layers using vias. Connect this pad
to a copper island on the PCB board with the same shape as the pad; this is electrically connected to PHASE Pin 16.
PD2 PVIN Thermal Pad Used for both the PVIN pin (Pin 17) and for heat removal connecting to heat dissipation layers using vias. Connect this pad
to a copper island on the PCB board with the same shape as the pad; this is electrically connected to PVIN Pin 17.
PD3 PGND Thermal Pad Used for both the PGND pin (Pin 18) and for heat removal connecting to heat dissipation layers using vias. Connect this pad
to a copper island on the PCB board with the same shape as the pad; this is electrically connected to PGND Pin 18.
PD4 VOUT Thermal Pad Used for both the VOUT pin (Pin 19) and for heat removal connecting to heat dissipation layers using vias. Connect this pad
to a copper island on the PCB board with the same shape as the pad; this is electrically connected to VOUT Pin 19.
Typical Application Circuits
PVIN
GROUND
ISFETDRV1
PVIN
VIN
FF
EN
FSYNC_IN
CLKOUT
ISHARE_BUS
ISFETDRV
ISL8200AM
VOUT
VOUT_SET
VSEN_REM-
PGOOD
PH_CNTRL
VCC
RSET
2.2k
PGOOD
VCC
VOUT
VOUT
GROUND
SET R1 AND R2 SO THAT
0.8V ≤ VEN ≤ 5.0V
DO NOT TIE EN DIRECTLY TO A POWER SOURCE
RSET CAN CHANGE VOUT
Refer to Table 1
FIGURE 4. SINGLE PHASE 10A 1.2V OUTPUT CIRCUIT
FN8271 Rev.7.00
Apr 27, 2018
Page 5 of 25
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