ISL8200AM 查看數據表（PDF） - Renesas Electronics
零件编号
产品描述 (功能)
生产厂家
ISL8200AM Datasheet PDF : 25 Pages
| |||
ISL8200AM
Electrical Specifications Boldface limits apply across the operating temperature range, -40°C to +85°C for ISL8200AMIRZ and -55°C
to +125°C for ISL8200AMMRZ. (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
(Note 7) (Note 6) (Note 7) UNIT
OVERCURRENT PROTECTION (Note 8)
Channel Overcurrent Limit
Share Pin OC Threshold
CURRENT SHARE
ISOURCE
VOC_ISHARE
VCC = 5V; ISL8200AMIRZ
VCC = 5V; ISL8200AMMRZ
Comparator offset included
89
111
129
µA
84
111
129
µA
1.16
1.20
1.22
V
External Current Share Accuracy
Up to three phases; ISL8200AMIRZ
±10
%
POWER GOOD MONITOR (Note 8)
Undervoltage Falling Trip Point
Undervoltage Rising Hysteresis
Overvoltage Rising Trip Point
Overvoltage Falling Hysteresis
PGOOD Low Output Voltage
Sinking Impedance
Maximum Sinking Current
OVERVOLTAGE PROTECTION (Note 8)
VUVF
VUVR_HYS
VOVR
VOVF_HYS
Percentage below reference point
Percentage above UV trip point
Percentage above reference point
Percentage below OV trip point
IPGOOD = 2mA
IPGOOD = 2mA
VPGOOD < 0.8V
-15
-13
-11
%
4
%
11
13
15
%
4
%
0.35
V
70
Ω
10
mA
OV Latching Trip Point
EN = UGATE = LATCH Low, LGATE = High
118
120
122
%
OV Non-latching Trip Point
EN = Low, UGATE = Low, LGATE = High
113
%
LGATE Release Trip Point
EN = Low/HIGH, UGATE = Low, LGATE = Low
87
%
OVER-TEMPERATURE PROTECTION CONTROLLER JUNCTION TEMPERATURE
Over-temperature Trip
Over-temperature Release Threshold
150
°C
125
°C
INTERNAL COMPONENT VALUES
Internal Resistor Between PVCC and
RCC
VCC pin
5
Ω
Internal Resistor Between PHASE and
OCSET Pins
RISEN-IN
2.2k
Ω
Internal Resistor Between FSYNC_IN
RFS
and PGND1 Pins
59k
Ω
Internal Resistor Between PGOOD and
RPG
VCC Pins
10k
Ω
Internal Resistor Between CLKOUT and
VCC Pins
RCLK
10k
Ω
Internal Resistor Between PH_CNTRL
and VCC Pins
RPHC
10k
Ω
Internal Resistor Between VOUT_SET
and VSEN_REM- pin
ROS1
2.2k
Ω
NOTES:
6. Parameters with TYP limits are not production tested, unless otherwise specified.
7. Parameters with MIN and/or MAX limits are 100% tested for internal IC prior to module assembly, unless otherwise specified. Temperature limits
established by characterization and are not production tested.
8. Compliance to datasheet limits is assured by one or more methods: production test, characterization, and/or design.
FN8271 Rev.7.00
Apr 27, 2018
Page 9 of 25
Share Link: 