ISL8200AMM 查看數據表（PDF） - Renesas Electronics
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ISL8200AMM Datasheet PDF : 24 Pages
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ISL8200AMM
Pin Descriptions (Continued)
PIN # PIN NAME
PIN DESCRIPTION
23
NC
Not internal connected
PD1 Phase Thermal Pad Used for both the PHASE pin (Pin # 16) and for heat removal connecting to heat dissipation layers using vias. Connect this
pad to a copper island on the PCB board with the same shape as the pad; this is electrically connected to PHASE pin 16.
PD2 PVIN Thermal Pad Used for both the PVIN pin (Pin # 17) and for heat removal connecting to heat dissipation layers using vias. Connect this pad
to a copper island on the PCB board with the same shape as the pad; this is electrically connected to PVIN pin 17.
PD3 PGND Thermal Pad Used for both the PGND pin (Pin # 18) and for heat removal connecting to heat dissipation layers using vias. Connect this pad
to a copper island on the PCB board with the same shape as the pad; this is electrically connected to PGND pin 18.
PD4 VOUT Thermal Pad Used for both the VOUT pin (Pin # 19) and for heat removal connecting to heat dissipation layers using vias. Connect this pad
to a copper island on the PCB board with the same shape as the pad; this is electrically connected to VOUT pin 19.
Typical Application Circuits
PVIN
GROUND
ISFETDRV1
PVIN
VIN
FF
EN
FSYNC_IN
VOUT
VOUT_SET
VSEN_REM-
ISL8200AMMREP
PGOOD
CLKOUT
ISHARE_BUS
ISFETDRV
PH_CNTRL
VCC
RSET
2.2k
PGOOD
VCC
VOUT
VOUT
GROUND
SET R1 AND R2 SUCH THAT
0.8V ≤ VEN ≤ 5.0V
DO NOT TIE EN DIRECTLY TO A POWER SOURCE
RSET CAN CHANGE VOUT
REFER TO TABLE 1
FIGURE 3. SINGLE PHASE 10A 1.2V OUTPUT CIRCUIT
FN8287 Rev 2.00
June 3, 2015
Page 5 of 24
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