MA4P102 查看數據表（PDF） - M/A-COM Technology Solutions, Inc.
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MA4P102 Datasheet PDF : 10 Pages
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AN3021
PIN Diodes for Microwave Switch Designs
Rev. V2
Table 2: Relative PIN Diode Performance Evaluation Matrix
Key Parameter
1 MHz < F < 1 GHz
Surface Mount Assembly
Plastic
MELF or Hi-
Pax
SURMOUNT
Best Selection
Chip & Wire Hybrid Assembly
Cerma Chip
Flip Chip
Beam Lead
100 MHz < F < 4 GHz Best Selection
4 GHz < F < 20 GHz
Best Selection
20 GHz < F < 60 GHz
Best Selection Best Selection
100 MHz < F < 20 GHz
Best Selection
Pinc < 0.1 W
Best Selection
0.1 W < Pinc < 1 W Best Selection
Best Selection
1 W < Pinc < 20 W
Best Selection
20 W < Pinc < 200 W
Best Selection
Best Selection
Relative Cost Index
Lowest
Moderate/Highest Moderate/Highest
Lowest
Moderate
Highest
Conclusions:
1. Plastic Devices are best suited where Cost is a decision driver, the Operating Frequency < 4 GHz, and the
RF C.W. Incident Power < 1 W ( + 30 dBm ).
2. MELF or HIPAX Ceramic Devices are best utilized where Highest Average Power ( > 20 W C.W. ) is the
Primary Design Goal and the Operating Frequency < 1 GHz.
3. SURMOUNT Devices are probably the Best Overall Compromise in Device Selection. They can Operate
( In Various bands ) from 10 MHz – 20 GHz and Perform well with RF Incident Power < 20 W C.W ( + 43
dBm ).
4. Cermachip Devices provide the Best Overall Performance for Operating Frequeny ( 100 MHz – 20
GHz ) , and RF Incident Power < 200 W C.W (+ 53 dBm ).
5. Flip Chip Devices are best suited for mmwave Frequencies < 60 GHz, where the RF Incident C.W. < 1W
( + 30 dBm ) and Conductive Epoxy or Soldering is Required.
6. Beam Lead Devices are best suited for mmwave Frequencies < 60 GHz, where the RF Incident C.W. <
0.1W ( + 20 dBm ) and Thermo Compression Bonding is Required.
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ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
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Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
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