MK52DN512CMD10 查看數據表（PDF） - NXP Semiconductors.
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MK52DN512CMD10 Datasheet PDF : 82 Pages
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Table of Contents
1 Ordering parts...........................................................................4
6 Peripheral operating requirements and behaviors....................23
1.1 Determining valid orderable parts......................................4
6.1 Core modules....................................................................23
2 Part identification......................................................................4
6.1.1 Debug trace timing specifications.......................23
2.1 Description.........................................................................4
6.1.2 JTAG electricals..................................................24
2.2 Format...............................................................................4
6.2 System modules................................................................27
2.3 Fields.................................................................................4
6.3 Clock modules...................................................................27
2.4 Example............................................................................5
6.3.1 MCG specifications.............................................27
3 Terminology and guidelines......................................................5
6.3.2 Oscillator electrical specifications.......................29
3.1 Definition: Operating requirement......................................5
6.3.3 32 kHz oscillator electrical characteristics..........32
3.2 Definition: Operating behavior...........................................6
6.4 Memories and memory interfaces.....................................32
3.3 Definition: Attribute............................................................6
6.4.1 Flash electrical specifications.............................32
3.4 Definition: Rating...............................................................7
6.4.2 EzPort switching specifications...........................34
3.5 Result of exceeding a rating..............................................7
6.4.3 Flexbus switching specifications.........................35
3.6 Relationship between ratings and operating
6.5 Security and integrity modules..........................................38
requirements......................................................................7
6.6 Analog...............................................................................38
3.7 Guidelines for ratings and operating requirements............8
6.6.1 ADC electrical specifications..............................38
3.8 Definition: Typical value.....................................................8
6.6.2 CMP and 6-bit DAC electrical specifications......46
3.9 Typical value conditions....................................................9
6.6.3 12-bit DAC electrical characteristics...................49
4 Ratings......................................................................................10
6.6.4 Op-amp electrical specifications.........................52
4.1 Thermal handling ratings...................................................10
6.6.5 Transimpedance amplifier electrical
4.2 Moisture handling ratings..................................................10
specifications — full range..................................53
4.3 ESD handling ratings.........................................................10
6.6.6 Transimpedance amplifier electrical
4.4 Voltage and current operating ratings...............................10
specifications — limited range............................54
5 General.....................................................................................11
6.6.7 Voltage reference electrical specifications..........55
5.1 AC electrical characteristics..............................................11
6.7 Timers................................................................................56
5.2 Nonswitching electrical specifications...............................11
6.8 Communication interfaces.................................................56
5.2.1 Voltage and current operating requirements......12
6.8.1 Ethernet switching specifications........................56
5.2.2 LVD and POR operating requirements...............13
6.8.2 USB electrical specifications...............................58
5.2.3 Voltage and current operating behaviors............13
6.8.3 USB DCD electrical specifications......................58
5.2.4 Power mode transition operating behaviors.......15
6.8.4 USB VREG electrical specifications...................59
5.2.5 Power consumption operating behaviors............16
6.8.5 DSPI switching specifications (limited voltage
5.2.6 EMC radiated emissions operating behaviors....19
range).................................................................59
5.2.7 Designing with radiated emissions in mind.........20
6.8.6 DSPI switching specifications (full voltage
5.2.8 Capacitance attributes........................................20
range).................................................................61
5.3 Switching specifications.....................................................20
6.8.7 Inter-Integrated Circuit Interface (I2C) timing..... 63
5.3.1 Device clock specifications.................................20
6.8.8 UART switching specifications............................64
5.3.2 General switching specifications.........................21
6.8.9 SDHC specifications...........................................64
5.4 Thermal specifications.......................................................22
6.8.10 I2S/SAI switching specifications.........................65
5.4.1 Thermal operating requirements.........................22
6.9 Human-machine interfaces (HMI)......................................71
5.4.2 Thermal attributes...............................................22
6.9.1 TSI electrical specifications................................71
K52 Sub-Family Data Sheet, Rev. 3, 6/2013.
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Freescale Semiconductor, Inc.
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