LT1120C(RevB) 查看數據表（PDF） - Linear Technology
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LT1120C Datasheet PDF : 12 Pages
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PACKAGE DESCRIPTIO Dimensions in inches (millimeters) unless otherwise noted.
LT1120
H Package
8-Lead TO-5 Metal Can (0.200 PCD)
(LTC DWG # 05-08-1320)
0.040
(1.016)
MAX
SEATING
PLANE
0.010 – 0.045*
(0.254 – 1.143)
0.335 – 0.370
(8.509 – 9.398)
DIA
0.305 – 0.335
(7.747 – 8.509)
0.050
(1.270)
MAX
0.165 – 0.185
(4.191 – 4.699)
0.016 – 0.021**
(0.406 – 0.533)
GAUGE
PLANE
0.500 – 0.750
(12.700 – 19.050)
45°TYP
0.028 – 0.034
(0.711 – 0.864)
REFERENCE
PLANE
0.110 – 0.160
(2.794 – 4.064)
INSULATING
STANDOFF
0.027 – 0.045
(0.686 – 1.143)
PIN 1
0.200
(5.080)
TYP
*LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE
AND 0.045" BELOW THE REFERENCE PLANE
**FOR
SOLDER
DIP
LEAD
FINISH,
LEAD
DIAMETER
IS
0.016
(0.406
–
–
0.024
0.610)
H8(TO-5) 0.200 PCD 1197
0.300 BSC
(0.762 BSC)
0.008 – 0.018
(0.203 – 0.457)
0° – 15°
NOTE: LEAD DIMENSIONS APPLY
TO SOLDER DIP/PLATE
OR TIN PLATE LEADS
0.045 – 0.068
(1.143 – 1.727)
0.014 – 0.026
(0.360 – 0.660)
J8 Package
8-Lead CERDIP (Narrow 0.300, Hermetic)
(LTC DWG # 05-08-1110)
0.200
(5.080)
MAX
0.005
(0.127)
MIN
0.405
(10.287)
MAX
8
7
6
5
CORNER LEADS OPTION
(4 PLCS)
0.015 – 0.060
(0.381 – 1.524)
0.025
(0.635)
RAD TYP
0.125
3.175
0.100 ± 0.010 MIN
(2.540 ± 0.254)
0.220 – 0.310
(5.588 – 7.874)
1
2
3
4
0.045 – 0.068
(1.143 – 1.727)
FULL LEAD
OPTION
0.023 – 0.045
(0.584 – 1.143)
HALF LEAD
OPTION
J8 1197
0.300 – 0.325
(7.620 – 8.255)
N8 Package
8-Lead PDIP (Narrow 0.300)
(LTC DWG # 05-08-1510)
0.045 – 0.065
(1.143 – 1.651)
0.130 ± 0.005
(3.302 ± 0.127)
0.400*
(10.160)
MAX
8
7
6
5
0.009 – 0.015
(0.229 – 0.381)
0.065
(1.651)
TYP
+0.035
0.325 –0.015
( ) 8.255
+0.889
–0.381
0.100 ± 0.010
(2.540 ± 0.254)
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.010 INCH (0.254mm)
0.125
(3.175)
MIN
0.018 ± 0.003
(0.457 ± 0.076)
0.020
(0.508)
MIN
0.255 ± 0.015*
(6.477 ± 0.381)
12
34
N8 1197
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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