PCF8564ACX9 查看數據表（PDF） - NXP Semiconductors.

零件编号

产品描述 (功能)

生产厂家

PCF8564ACX9

Real time clock and calendar

NXP Semiconductors. 

NXP Semiconductors

PCF8564A

Real time clock and calendar

4. Ordering information

Table 1. Ordering information

Type number

Package

Name

Description

PCF8564AU/5BB/1 PCF8564AU wire bond die; 9 bonding pads

PCF8564AU/5GB/1 PCF8564AU wire bond die; 9 bonding pads

PCF8564AU/5GC/1 PCF8564AU wire bond die; 9 bonding pads

PCF8564AU/10AB/1 PCF8564AU wire bond die; 9 bonding pads

PCF8564ACX9/1

PCF8564ACX9 wafer level chip-size package;

9 bumps; 1.27 × 1.9 × 0.29 mm

PCF8564ACX9/B/1

PCF8564ACX9 wafer level chip-size package;

9 bumps; 1.27 × 1.9 × 0.29 mm

5. Marking

Delivery form

unsawn wafer

unsawn wafer

unsawn wafer

wafer sawn on FFC

wafer sawn on FFC;

die with solder bumps

tape and reel;

die with solder bumps

Version

PCF8564AU

PCF8564AU

PCF8564AU

PCF8564AU

PCF8564ACX9

PCF8564ACX9

Table 2. Marking codes

Type number

PCF8564AU/5BB/1

PCF8564AU/5GB/1

PCF8564AU/5GC/1

PCF8564AU/10AB/1

PCF8564ACX9/1

PCF8564ACX9/B/1

Marking code

PC8564A-1

PC8564A-1

PC8564A-1

PC8564A-1

PC8564A-1

PC8564A-1

PCF8564A

Product data sheet

All information provided in this document is subject to legal disclaimers.

Rev. 02 — 30 September 2010

© NXP B.V. 2010. All rights reserved.

2 of 45

Share Link: