MSK155(2014) 查看數據表（PDF） - M.S. Kennedy
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MSK155 Datasheet PDF : 6 Pages
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ABSOLUTE MAXIMUM RATINGS 9
VCC
±IOUT
VIND
VIN
TJ
Total Supply Voltage ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ 80V
Output Current (within S.O.A.) ○ ○ ○ ○ ○ ±5A
Input Voltage (Differential)
±Vcc
○
○
○
○
○
○
○
Input Voltage (Common Mode) ○ ○ ○ ○ ○ ±Vcc
Junction Temperature ○ ○ ○ ○ ○ ○ ○ ○ ○ 150°C
TST
Storage
Temperature
10
○
○
○
○
○ -65°C to +150°C
TLD
Lead Temperature ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ 300°C
TC Case Operating Temperature
(MSK155H) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ -55°C to +125°C
(MSK155) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ -40°C to +85°C
RTH Thermal Resistance (DC)
Junction to Case ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ 2.0°C/W
ELECTRICAL SPECIFICATIONS
Parameter
Test Conditions 1
STATIC
Supply Voltage Range 4
Quiescent Current
Each Amp
VIN=0V
INPUT
Offset Voltage
VIN=0V
Offset Voltage Drift 4
Offset Voltage vs ±Vcc 2
VIN=0V
VIN=0V
Input Bias Current 4
VCM=0V
Input Impedance 2
Input Capacitance 2
Common Mode Rejection 4
Noise 2
OUTPUT
Output Voltage Swing 2
Output Voltage Swing
Power Bandwidth 4
Settling Time to 0.1% 3 2
Capacitive Load 4
TRANSFER CHARACTERISTICS
Slew Rate 4
Open Loop Voltage Gain 4
(DC)
VCM=±22VDC
F = 10Hz to 1KHz
RL=10K
IOUT=5A Pk
RL = 10Ω VOUT=20VRMS
2V Step
AV=+10V/V
VOUT = ±10V RL = 10Ω
F=10Hz RL = 10KΩ
Group A
MSK155H
MSK155 5
Subgroup Min. Typ. Max. Min. Typ. Max.
Units
-
±10 ±35 ±40 ±10 ±35 ±40
V
1
-
±20 ±30 -
±20 ±35 mA
2
-
±20 ±30 -
-
-
mA
3
-
±20 ±30 -
-
-
mA
1
2,3
2,3
-
1
2, 3
-
-
4
-
- ±0.1 ±2 - ±0.1 ±10 mV
-
±2 ±10 -
-
-
mV
-
±10 ±50 -
±10
- μV/°C
-
±5
-
-
±5
-
μV/V
-
±20 ±100 -
±20 ±200 pA
-
- ±150 -
-
-
nA
-
10
-
-
10
-
Ω
-
5
-
-
5
-
pF
95 110
-
90 110
-
dB
-
10
-
-
10
-
μVRMS
-
- ±33.5 -
- ±33.5 -
V
4
±29 ±30
- ±29 ±30
-
V
4
45
55
-
40
55
-
KHz
-
-
2
-
-
2
-
μS
-
10
-
-
10
-
-
nF
4
6
10
-
6
10
-
V/μS
4
95 100
-
90 100
-
dB
NOTES:
1 Unless otherwise noted ±VCC= ±35VDC, RCL = 0Ω and specifications apply to each amplifier.
2 Typical parameters are for reference only.
3 AV=-1V/V measured in false summing junction circuit.
4 Devices shall be capable of meeting the parameter, but need not be tested.
5 Industrial grade devices shall be tested to subgroups 1 and 4 unless otherwise requested.
6 Military grade devices ('H' suffix) shall be 100% tested to subgroups 1,2,3 and 4.
7 Subgroup 5 and 6 testing available upon request.
8 Subgroup 1,4 TC=+25°C
Subgroup 2,5 TC=+125°C
Subgroup 3,6 TA=-55°C
9 Continuous operation at or above absolute maximum ratings may adversely effect the device performance and/or life cycle.
10 Internal solder reflow temperature is 180°C, do not exceed.
2
8548-126 Rev. E 6/14
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