MC78L08ABPG(2010) 查看數據表（PDF） - ON Semiconductor
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MC78L08ABPG Datasheet PDF : 18 Pages
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MC78L00A Series,
NCV78L00A
100 mA Positive Voltage
Regulators
The MC78L00A Series of positive voltage regulators are
inexpensive, easy−to−use devices suitable for a multitude of
applications that require a regulated supply of up to 100 mA. Like
their higher powered MC7800 and MC78M00 Series cousins, these
regulators feature internal current limiting and thermal shutdown
making them remarkably rugged. No external components are
required with the MC78L00 devices in many applications.
These devices offer a substantial performance advantage over the
traditional zener diode−resistor combination, as output impedance
and quiescent current are substantially reduced.
Features
• Wide Range of Available, Fixed Output Voltages
• Low Cost
• Internal Short Circuit Current Limiting
• Internal Thermal Overload Protection
• No External Components Required
• Complementary Negative Regulators Offered (MC79L00A Series)
• Pb−Free Packages are Available
• NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
15k
Q1
3.8k
Q3
Q5
Q4 Q6
Input
Q11
Q12
Q10
5.0k 3.0 Output
0-25k
1.2k
Z1
Q2
420
1.9k 19k 2.2k
C
Q9
Q8
Q7
1.0k
2.85k
Ground
Figure 1. Representative Schematic Diagram
Input
MC78LXXA
Output
Cin*
0.33 mF
CO**
0.1 mF
Figure 2. Standard Application
A common ground is required between the input and the output voltages. The
input voltage must remain typically 2.0 V above the output voltage even during
the low point on the input ripple voltage.
* Cin is required if regulator is located an appreciable distance from power
supply filter.
** CO is not needed for stability; however, it does improve transient response.
http://onsemi.com
123
STRAIGHT LEAD
BULK PACK
TO−92
P SUFFIX
CASE 029
1
2
3
BENT LEAD
TAPE & REEL
AMMO PACK
Pin: 1. Output
2. Ground
3. Input
8
1
SOIC−8*
D SUFFIX
CASE 751
*SOIC−8 is an internally modified SO−8 package. Pins
2, 3, 6, and 7 are electrically common to the die attach
flag. This internal lead frame modification decreases
package thermal resistance and increases power
dissipation capability when appropriately mounted on
a printed circuit board. SOIC−8 conforms to all ex-
ternal dimensions of the standard SO−8 package.
PIN CONNECTIONS
VOUT 1
GND 2
GND 3
NC 4
8 VIN
7 GND
6 GND
5 NC
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking
section on page 16 of this data sheet.
© Semiconductor Components Industries, LLC, 2010
1
January, 2010 − Rev. 15
Publication Order Number:
MC78L00A/D
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