MC78L08ABPG(2010) 查看數據表（PDF） - ON Semiconductor
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MC78L08ABPG Datasheet PDF : 18 Pages
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MC78L00A Series, NCV78L00A
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage (5.0 V−9.0 V)
Input Voltage (12 V−18 V)
Input Voltage (24 V)
VI
30
Vdc
35
40
Storage Temperature Range
Maximum Junction Temperature
Moisture Sensitivity Level
Tstg
−65 to +150
°C
TJ
150
°C
MSL
1
−
ESD Capability, Human Body Model (Note 1)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 1)
ESDMM
200
V
ESD Capability, Charged Device Model (Note 1)
ESDCDM
2000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
ESD Charged Device Model tested per EIA/JES D22/C101, Field Induced Charge Model.
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Package Dissipation
PD
Internally Limited
W
Thermal Characteristics, TO−92
Thermal Resistance, Junction−to−Ambient
RqJA
200
°C/W
Thermal Characteristics, SOIC8
Thermal Resistance, Junction−to−Ambient
RqJA
Refer to Figure 8
°C/W
2. Thermal Resistance, Junction−to−Ambient depends on P.C.B. Copper area. See details in Figure 8.
Thermal Resistance, Junction−to−Case is not defined. SOIC 8 lead and TO-92 packages that do not have a heat sink like other packages
may have. This is the reason that a Theta JC is never specified. A little heat transfer will occur through the package but since it is plastic, it is
minimal. The majority of the heat that is transferred is through the leads where they connect to the circuit board.
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