STTA406 查看數據表（PDF） - STMicroelectronics
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STTA406 Datasheet PDF : 5 Pages
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STTA406
Fig. 1: Power dissipation versus average forward
current.
PF(av)(W)
3.5
3.0
δ = 0.05
δ = 0.1 δ = 0.2
δ = 0.5
2.5
δ=1
2.0
1.5
1.0
T
0.5
IF(av)(A)
δ=tp/T
tp
0.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
Fig. 2: Average forward current versus ambient
temperature (δ=0.5).
IF(av)(A)
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0
Rth(j-a)=Rth(j-l)
Rth(j-a)=75°C/W
T
δ=tp/T
tp
25
Tamb(°C)
50
75
100
125
Fig. 3: Relative variation of thermal impedance
junction to ambient versus pulse duration (epoxy
printed circuit board, e(Cu)=35µm), recommended
pad layout).
K=[Zth(j-a)/Rth(j-a)]
1E+0
δ = 0.5
δ = 0.2
δ = 0.1
1E-1
1E-2
T
Single pulse
1E-3
1E-3 1E-2
1E-1
tp(s)
δ=tp/T
tp
1E+0 1E+1 1E+2 1E+3
Fig 4-2 : Forward voltage drop versus forward
current (high level).
IFM(A)
50
Tj=125°C
Typical values
Tj=125°C
10
Maximum values
Tj=25°C
Maximum values
VFM(V)
1
0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
Fig. 4-1: Forward voltage drop versus forward
current (low level).
IFM(A)
5
4
Tj=125°C
Typical values
3
Tj=125°C
Maximum values
2
1
Tj=25°C
Maximum values
VFM(V)
0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
3/5
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