TSL257T 查看數據表（PDF） - austriamicrosystems AG

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TSL257T

HIGH-SENSITIVITY LIGHT-TO-VOLTAGE CONVERTER

austriamicrosystems AG 

TSL257T

HIGH-SENSITIVITY

LIGHT-TO-VOLTAGE CONVERTER

TAOS065B − APRIL 2007

MANUFACTURING INFORMATION

The reflow profile specified here describes expected maximum heat exposure of devices during the solder

reflow process of the device on a PWB. Temperature is measured at the top of the device. Devices should be

limited to one pass through the solder reflow profile.

Table 1. TSL257T Solder Reflow Profile

PARAMETER

Average temperature gradient in preheating

Soak time

lid Time above T1, 217°C

Time above T2, 230°C

Time above T3, (Tpeak −10°C)

a Peak temperature in reflow

v Temperature gradient in cooling

REFERENCE

tsoak

t1

t2

t3

Tpeak

TSL257T

2.5°C/sec

2 to 3 minutes

Max 60 sec

Max 50 sec

Max 10 sec

260° C (−0°C/+5°C)

Max −5°C/sec

till Tpeak

T3

G s T2

A t T1

Not to scale — for reference only

Technicaaml sconten Time(sec)

t3

t2

tsoak

t1

Figure 10. TSL257T Solder Reflow Profile

Copyright E 2007, TAOS Inc.

8

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www.taosinc.com

The LUMENOLOGY r Company

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