SZESD5Z7.0T5G 查看數據表（PDF） - ON Semiconductor
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SZESD5Z7.0T5G Datasheet PDF : 6 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
2
2
1
1
STYLE 1 STYLE 2
SCALE 4:1
−X−
D
−Y−
E
1
2
2X b
0.08 M X Y
TOP VIEW
A
c
HE
SIDE VIEW
SOD−523
CASE 502−01
ISSUE E
DATE 28 SEP 2010
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
MILLIMETERS
DIM MIN NOM MAX
A 0.50 0.60 0.70
b
0.25 0.30 0.35
c
0.07 0.14 0.20
D 1.10 1.20 1.30
E 0.70 0.80 0.90
H E 1.50 1.60 1.70
L
0.30 REF
L2 0.15 0.20 0.25
GENERIC
MARKING DIAGRAM*
2X L
2X L2
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
2X
0.48
1.80
2X
0.40
XX
1
2
STYLE 1
XX
1
2
STYLE 2
XX = Specific Device Code
M Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
STYLE 1:
PIN 1. CATHODE (POLARITY BAND)
2. ANODE
STYLE 2:
NO POLARITY
PACKAGE
OUTLINE
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON11524D
DESCRIPTION: SOD−523
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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