MKE02Z32VLH2 查看數據表（PDF） - NXP Semiconductors.

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MKE02Z32VLH2

KE02 Sub-Family Data Sheet

NXP Semiconductors. 

Table of Contents

1 Ordering parts.......................................................................................4

5.2.2 FTM module timing....................................................... 17

1.1 Determining valid orderable parts............................................... 4

5.3 Thermal specifications................................................................. 18

2 Part identification................................................................................. 4

5.3.1 Thermal operating requirements.................................... 18

2.1 Description...................................................................................4

5.3.2 Thermal characteristics.................................................. 18

2.2 Format.......................................................................................... 4

6 Peripheral operating requirements and behaviors................................ 20

2.3 Fields............................................................................................4

6.1 Core modules............................................................................... 20

2.4 Example....................................................................................... 5

6.1.1 SWD electricals .............................................................20

3 Parameter classification........................................................................5

6.2 External oscillator (OSC) and ICS characteristics.......................21

4 Ratings..................................................................................................6

6.3 NVM specifications..................................................................... 23

4.1 Thermal handling ratings............................................................. 6

6.4 Analog..........................................................................................24

4.2 Moisture handling ratings............................................................ 6

6.4.1 ADC characteristics....................................................... 24

4.3 ESD handling ratings................................................................... 6

6.4.2 Analog comparator (ACMP) electricals.........................27

4.4 Voltage and current operating ratings..........................................7

6.5 Communication interfaces........................................................... 27

5 General................................................................................................. 7

6.5.1 SPI switching specifications.......................................... 27

5.1 Nonswitching electrical specifications........................................ 7

7 Dimensions...........................................................................................31

5.1.1 DC characteristics.......................................................... 7

7.1 Obtaining package dimensions.................................................... 31

5.1.2 Supply current characteristics........................................ 14

8 Pinout................................................................................................... 32

5.1.3 EMC performance..........................................................15

8.1 Signal multiplexing and pin assignments.................................... 32

5.2 Switching specifications.............................................................. 16

8.2 Device pin assignment................................................................. 34

5.2.1 Control timing................................................................ 16

9 Revision history....................................................................................36

KE02 Sub-Family Data Sheet, Rev. 7, 12/2019

NXP Semiconductors

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