Revision History
1.8
1.9
• Ordering Information, page 5 was updated to include lead-free package ordering codes (SAR
21968)
• The User Security, page 14 was revised to clarify that although no existing security measures can
give an absolute guarantee, Microsemi FPGAs implement the best security available in the industry
(SAR 34673)
• The Transient Current, page 15 is new (SAR 36930).
• Package names were revised according to standards established in Package Mechanical Drawings
(SAR 34774)
Revision 9.0
The following is a summary of the changes in revision 9.0 of this document
• In Table 20, page 25, the limits in VI were changed from -0.5 to VCCI + 0.5 to -0.5 to VCCA + 0.5
In Table 22, page 27, VOH was changed from 3.7 to 2.4 for the min in industrial and military. VIH had VCCI
and that was changed to VCCA
Revision 6.0
The following is a summary of the changes in revision 6.0 of this document.
• The Ease of Integration, page 3 was updated
• The Temperature Grade Offerings, page 7 is new
• The Speed Grade Offerings, page 7 is new
• The General Description, page 8 was updated
• The MultiPlex I/O Modules, page 13 was updated
• The User Security, page 14 was updated
• Table 6, page 15 was updated
• The Power Dissipation, page 16 was updated.
• The Static Power Component, page 16 was updated
• The Equivalent Capacitance, page 17 was updated
• Figure 13, page 19 was updated
• Table 10, page 20 was updated.
• Figure 14, page 20 was updated.
• Table 11, page 21 was updated.
DS2316 Datasheet Revision 16.0
2