PACKAGE OUTLINE
Plastic surface mounted package; 2 leads
∠ALL ROUND
ES1AF-ES1JF
SMAF
∠ALL ROUND
HE
VM A
E
g
D
A
g
Top View
Bottom View
UNIT
A
C
D
E
e
g
HE
∠
max 1.1 0.20 3.7 2.7 1.6 1.2 4.9
mm
min 0.9 0.12 3.3 2.4 1.3 0.8 4.4
7°
max 43 7.9 146 106 63 47 193
mil
min 35 4.7 130 94 51 31 173
The recommended mounting pad size
1.6
2.2
1.6
(63)
(86)
(63)
mm
Unit :
(mil)
Shanghai Leiditech Electronic Co.,Ltd
Email: sale1@leiditech.com
Tel : +86- 021 50828806
Fax : +86- 021 50477059
Rev 2.0 :12.01.2019
3/3
www.leiditech.com