B5817WS 查看數據表（PDF） - TSC Corporation
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B5817WS Datasheet PDF : 5 Pages
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Small Signal Product
PACKAGE OUTLINE DIMENSIONS
SOD-323
B5817WS/B5818WS/B5819WS
Taiwan Semiconductor
DIM.
A
B
C
D
E
F
G
H
Unit (mm)
Min
Max
1.15
1.40
2.30
2.70
0.25
0.45
1.60
1.80
0.80
1.00
0.05
0.17
0.475 REF
-
0.10
Unit (inch)
Min
Max
0.045 0.055
0.091 0.106
0.010 0.018
0.063 0.071
0.031 0.039
0.002 0.007
0.19 REF
-
0.004
SUGGESTED PAD LAYOUT
DIM.
A
B
C
D
Unit (mm)
Typ.
0.63
0.83
1.60
2.86
Unit (inch)
Typ.
0.025
0.033
0.063
0.113
Document Number: DS_S1404015
Version: A14
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