BB1110RC13 查看數據表（PDF） - BI Technologies

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BB1110RC13

Resistor capacitor network Thick film resistors Ceramic chip capacitors

BI Technologies 

MODEL BB1110RC

Resistor capacitor network

Thick film resistors

Ceramic chip capacitors

DISCRIPTION

Model BB1110RC is designed for terminating high-speed memory buses. Ideally suited for local

decoupling of data line drivers. These specialty networks employ solder balls for surface mount flip

chip attachment. Their unique construction yields extremely low capacitance and inductance

parasitics critical for these high-speed applications.

FEATURES

• Integrated resistor and capacitor network

• High density packaging

• High temperature solder balls

• Industry standard ball diameter and pitch

• Excellent high frequency performance

SCHEMATIC

C1-9 = 0.1uF

R1-9 = 50 Ω

ELECTRICAL1

Resistance Tolerance

Capacitance Tolerance

Capacitor Type

Capacitor Maximum Voltage

TCR

Operating Temperature Range

Maximum Resistor Power

Package Power Rating

± 1%

± 10%

X5R

10 volts

200 ppm/°C

-55°C to +85°C

0.05 watts at 70°C

1.0 watt @ 70°C

1 Specifications subject to change without notice.

BI Technologies Corporation

4200 Bonita Place, Fullerton, CA 92835 USA

Phone: 714 447 2345 Website: www.bitechnologies.com

August 30, 2005

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BI technologies

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