DSB15IM30UC 查看數據表（PDF） - IXYS CORPORATION

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DSB15IM30UC

Schottky Diode

IXYS CORPORATION 

Package TO-252 (DPak)

Symbol

I RMS

TVJ

Top

Tstg

Weight

Definition

RMS current

virtual junction temperature

operation temperature

storage temperature

Conditions

per terminal 1)

FC

mounting force with clip

1) IRMS is typically limited by the pin-to-chip resistance (1); or by the current capability of the chip (2). In case of (1) and a product

with multiple pins for one chip-potential, the current capability can be increased by connecting the pins as one contact.

Product Marking

Logo

Part number

IXYS

abcdefg

Assembly Line

Date Code

Z YY

WW

Part description

D = Diode

S = Schottky Diode

B = ultra low VF

15 = Current Rating [A]

IM = Single Diode

30 = Reverse Voltage [V]

UC = TO-252AA (DPak)

DSB15IM30UC

Ratings

min. typ. max. Unit

20 A

-55

150 °C

-55

125 °C

-55

150 °C

0.3

g

20

60 N

Ordering

Standard

Ordering Number

DSB15IM30UC

Marking on Product

SFEBUI

Delivery Mode

Tape & Reel

Quantity Code No.

2500 519510

Similar Part

DSA15IM45UC

DSA10IM100UC

DSA15IM150UC

DSA15IM200UC

Package

TO-252AA (DPak)

TO-252AA (DPak)

TO-252AA (DPak)

TO-252AA (DPak)

Voltage class

45

100

150

200

Equivalent Circuits for Simulation

I V0

R0

Schottky

V 0 max

R0 max

threshold voltage

slope resistance *

0.21

10.7

* on die level

T VJ = 150 °C

V

mΩ

IXYS reserves the right to change limits, conditions and dimensions.

© 2017 IXYS all rights reserved

Data according to IEC 60747and per semiconductor unless otherwise specified

20170911c

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