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SST32HF802 查看數據表(PDF) - Silicon Storage Technology

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SST32HF802
SST
Silicon Storage Technology SST
SST32HF802 Datasheet PDF : 28 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Multi-Purpose Flash (MPF) + SRAM ComboMemory
SST32HF802 / SST32HF162 / SST32HF164
Data Sheet
Sector- or Bank-Erase, the Toggle Bit is valid after the rising
edge of the sixth WE# (or BEF#) pulse. See Figure 10 for
Toggle Bit timing diagram and Figure 19 for a flowchart.
Flash Memory Data Protection
The SST32HF802/162/164 flash memory bank provides
both hardware and software features to protect nonvolatile
data from inadvertent writes.
Flash Hardware Data Protection
Noise/Glitch Protection: A WE# or BEF# pulse of less than
5 ns will not initiate a Write cycle.
VDD Power Up/Down Detection: The Write operation is
inhibited when VDD is less than 1.5V.
Write Inhibit Mode: Forcing OE# low, BEF# high, or WE#
high will inhibit the Flash Write operation. This prevents
inadvertent writes during power-up or power-down.
Flash Software Data Protection (SDP)
The SST32HF802/162/164 provide the JEDEC approved
software data protection scheme for all flash memory bank
data alteration operations, i.e., Program and Erase. Any
Program operation requires the inclusion of a series of
three-byte sequence. The three byte-load sequence is
used to initiate the Program operation, providing optimal
protection from inadvertent Write operations, e.g., during
the system power-up or power-down. Any Erase operation
requires the inclusion of six-byte load sequence. The
SST32HF802/162/164 devices are shipped with the soft-
ware data protection permanently enabled. See Table 4 for
the specific software command codes. During SDP com-
mand sequence, invalid SDP commands will abort the
device to the read mode, within Read Cycle Time (TRC).
Concurrent Read and Write Operations
The SST32HF802/162/164 provide the unique benefit of
being able to read from or write to SRAM, while simulta-
neously erasing or programming the Flash. This allows data
alteration code to be executed from SRAM, while altering
the data in Flash. The following table lists all valid states.
CONCURRENT READ/WRITE STATE TABLE
Flash
Program/Erase
Program/Erase
SRAM
Read
Write
The device will ignore all SDP commands when an Erase
or Program operation is in progress. Note that Product
Identification commands use SDP; therefore, these com-
mands will also be ignored while an Erase or Program
operation is in progress.
Product Identification
The product identification mode identifies the devices as
the SST32HFxxx and manufacturer as SST. This mode
may be accessed by software operations only. The
hardware device ID Read operation, which is typically
used by programmers, cannot be used on this device
because of the shared lines between flash and SRAM
in the multi-chip package. Therefore, application of
high voltage to pin A9 may damage this device. Users
may use the software product identification operation to
identify the part (i.e., using the device ID) when using multi-
ple manufacturers in the same socket. For details, see
Tables 3 and 4 for software operation, Figure 14 for the
software ID entry and read timing diagram and Figure 20
for the ID entry command sequence flowchart.
TABLE 1: PRODUCT IDENTIFICATION
Manufacturer’s ID
Device ID
SST32HF802
SST32HF162/164
Address
0000H
0001H
0001H
Data
00BFH
2781H
2782H
T1.1 520
Product Identification Mode Exit/Reset
In order to return to the standard read mode, the Software
Product Identification mode must be exited. Exiting is
accomplished by issuing the Exit ID command sequence,
which returns the device to the Read operation. Please
note that the software-reset command is ignored during an
internal Program or Erase operation. See Table 4 for soft-
ware command codes, Figure 15 for timing waveform and
Figure 20 for a flowchart.
Design Considerations
SST recommends a high frequency 0.1 µF ceramic capac-
itor to be placed as close as possible between VDD and
VSS, e.g., less than 1 cm away from the VDD pin of the
device. Additionally, a low frequency 4.7 µF electrolytic
capacitor from VDD to VSS should be placed within 1 cm of
the VDD pin.
©2001 Silicon Storage Technology, Inc.
4
S71171-05-000 8/01 520

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