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STP10NB60SFP 查看數據表(PDF) - STMicroelectronics

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STP10NB60SFP Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
STGP10NB60SFP
THERMAL DATA
Rthj-case Thermal Resistance Junction-case Max
Rthj-amb Thermal Resistance Junction-ambient Max
Rthc-sink Thermal Resistance Case-sink Typ
4.7
°C/W
62.5
°C/W
0.5
°C/W
ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED)
OFF
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
VBR(CES) Collector-Emitter Break-down IC = 250 µA, VGE = 0,
600
V
Voltage
VBR(CES) Emitter Collector Break-down IC = 1 mA, VGE = 0,
20
V
Voltage
ICES
Collector cut-off Current
(VGE = 0)
VCE = Max Rating ,Tj =25 °C
VCE = Max Rating ,Tj =125 °C
10
µA
100
µA
IGES
Gate-Emitter Leakage
Current (VCE = 0)
VGE = ± 20V , VCE = 0
± 100 nA
ON (1)
Symbol
VGE(th)
VCE(SAT)
Parameter
Gate Threshold Voltage
Collector-Emitter Saturation
Voltage
Test Conditions
VCE = VGE, IC = 250µA
VGE =15V, IC = 5 A, Tj= 25°C
VGE =15V, IC = 10 A, Tj= 25°C
VGE =15V, IC = 10 A, Tj= 125°C
Min.
2.5
Typ.
1.15
1.35
1.25
Max. Unit
5
V
V
1.7
V
V
DYNAMIC
Symbol
gfs
Cies
Coes
Cres
Qg
Parameter
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Gate Charge
ICL
Latching Current
Test Conditions
VCE = 25 V , IC =10 A
VCE = 25V, f = 1 MHz, VGE = 0
VCE = 400V, IC = 10 A,
VGE = 15V
Vclamp= 480V, RG= 1k,
Tj= 125°C
Min.
5
20
Typ.
610
65
12
33
Max. Unit
S
pF
pF
pF
nC
A
2/8

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