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STS17NF3LL(2003) 查看數據表(PDF) - STMicroelectronics

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STS17NF3LL Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
STS17NF3LL
THERMAL DATA
Rthj-amb
Rthj-lead
Tj
Tstg
(*)Thermal Resistance Junction-ambient
Thermal Resistance Junction-leads
Maximum Operating Junction Temperature
Storage Temperature
(*) When Mounted on 1 inch2 FR-4 board, 2 oz of Cu and t [ 10 sec.
Max
47
Max
16
-55 to 175
-55 to 175
°C/W
°C/W
°C
°C
ELECTRICAL CHARACTERISTICS (Tcase = 25 °C unless otherwise specified)
OFF
Symbol
Parameter
Test Conditions
Min. Typ. Max. Unit
V(BR)DSS
Drain-source
Breakdown Voltage
ID = 250 µA, VGS = 0
30
V
IDSS
Zero Gate Voltage
Drain Current (VGS = 0)
VDS = Max Rating
VDS = Max Rating TC = 125°C
1
µA
10
µA
IGSS
Gate-body Leakage
Current (VDS = 0)
VGS = ± 18 V
±100
nA
ON (*)
Symbol
VGS(th)
RDS(on)
Parameter
Gate Threshold Voltage
Static Drain-source On
Resistance
Test Conditions
VDS = VGS
ID = 250 µA
VGS = 10 V
VGS = 4.5 V
ID = 8.5 A
ID = 8.5 A
Min.
1
Typ. Max.
0.0045 0.0055
0.0055 0.007
Unit
V
DYNAMIC
Symbol
gfs (*)
Ciss
Coss
Crss
Parameter
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Test Conditions
VDS = 10 V
ID = 8.5 A
VDS = 25V, f = 1 MHz, VGS = 0
Min.
Typ.
37
2160
614
98
Max.
Unit
S
pF
pF
pF
2/8

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