AD8018 查看數據表（PDF） - Analog Devices

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AD8018

5 V, Rail-to-Rail, High-Output Current, xDSL Line Drive Amplifier

Analog Devices 

Parameter

Conditions

LOGIC INPUTS (PWDN1, 0)

Logic “1” Voltage

Logic “0” Voltage

Logic Input Bias Current

Standby Recovery Time

RL = 10 Ω, G = +2, IS = 90% of Typical

Specifications subject to change without notice.

Min Typ

2.0

240

500

AD8018

Max

Unit

V

0.8

V

␮A

ns

ABSOLUTE MAXIMUM RATINGS1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 V

Internal Power Dissipation2

Small Outline Package (R) . . . . . . . . . . . . . . . . . . . 650 mW

TSSOP Package (RU) . . . . . . . . . . . . . . . . . . . . . . 565 mW

Input Voltage (Common-Mode) . . . . . . . . . . . . . . . . . . . . ± VS

Logic Voltage, PWDN0, 1 . . . . . . . . . . . . . . . . . . . . . . . . . ± VS

Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . ± 1.6 V

Output Short Circuit Duration

. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves

Storage Temperature Range RU, R . . . . . . . –65°C to +150°C

Operating Temperature Range . . . . . . . . . . . –40°C to +85°C

Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300°C

NOTES

1Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

2Specification is for the device on a 4-layer board in free air at 85°C:

8-Lead SOIC Package: θJA = 100°C/W.

14-Lead TSSOP Package: θJA = 115°C/W.

ORDERING GUIDE

Model

Temperature Package

Range

Description

Package

Option

AD8018AR

–40°C to +85°C 8-Lead Plastic SO-8

SOIC

AD8018AR–REEL –40°C to +85°C 8-Lead SOIC SO-8

AD8018AR–REEL7 –40°C to +85°C 8-Lead SOIC SO-8

AD8018ARU

–40°C to +85°C 14-Lead Plastic RU-14

TSSOP

AD8018ARU–REEL –40°C to +85°C 14-Lead Plastic RU-14

TSSOP

AD8018ARU–REEL7 –40°C to +85°C 14-Lead Plastic RU-14

TSSOP

AD8018ARU–EVAL

Evaluation Board RU-14

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the AD8018

is limited by the associated rise in junction temperature. The

maximum safe junction temperature for plastic encapsulated

devices is determined by the glass transition temperature of the

plastic, approximately 150°C. Temporarily exceeding this limit

may cause a shift in parametric performance due to a change

in the stresses exerted on the die by the package. Exceeding a

junction temperature of 175°C for an extended period can result

in device failure.

While the AD8018 is internally short circuit protected, this may

not be sufficient to guarantee that the maximum junction tempera-

ture (150°C) is not exceeded under all conditions. To ensure

proper operation, it is necessary to observe the maximum power

derating curves.

2.0

TJ = 150؇C

1.5

8-LEAD SOIC PACKAGE

1.0

14-LEAD TSSOP PACKAGE

0.5

0

–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90

AMBIENT TEMPERATURE – ؇C

Figure 3. Plot of Maximum Power Dissipation vs.

Temperature

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the AD8018 features proprietary ESD protection circuitry, permanent damage may occur on

devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are

recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

REV. A

–3–

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