MAX17000A(2008_10) 查看數據表（PDF） - Maxim Integrated
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MAX17000A Datasheet PDF : 31 Pages
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Complete DDR2 and DDR3 Memory
Power-Management Solution
ELECTRICAL CHARACTERISTICS (continued)
(VIN = 12V, VCC = VDD = VSHDN = VREFIN = 5V, VCSL = 1.8V, STDBY = SKIP = AGND, TA = 0°C to +85°C, unless otherwise noted.
Typical values are at TA = +25°C.) (Note 1)
PARAMETER
SYMBOL
CONDITIONS
MIN TYP MAX UNITS
REFERENCE BUFFER (VTTR)
VTTR Output Accuracy (Adj)
VTTR Output Accuracy (Preset)
REFIN to VTTR
IVTT = ±1mA
-10
IVTT = ±3mA
-20
VCSL/2 to VTTR
IVTT = ±1mA
IVTT = ±3mA
-10
-20
+10
+20
mV
+10
+20
VTTR Maximum
Recommended Current
Source/sink
5
mA
FAULT DETECTION (SMPS)
SMPS OVP and PGOOD1
Upper Trip Threshold
SMPS OVP and PGOOD1
Upper Trip Threshold
Fault-Propagation Delay
tOVP FB forced 25mV above trip threshold
12
15
18
%
10
μs
SMPS Output Undervoltage
Fault-Propagation Delay
tUVP
200
μs
SMPS PGOOD1 Lower Trip
Threshold
Measured at FB, hysteresis = 25mV
-12
-15
-18
%
PGOOD1 Lower Trip Threshold
Propagation Delay
tPGOOD1
FB forced 50mV below PGOOD1 trip
threshold
10
μs
PGOOD1 Output Low Voltage
PGOOD1 Leakage Current
IPGOOD1
ISINK = 3mA
FB = 1V (PGOOD1 high impedance),
PGOOD1 forced to 5V, TA = +25°C
0.4
V
1
μA
TON POR Threshold
VPOR(IN)
Rising edge, PWM disabled below this level;
hysteresis = 200mV
3.0
V
FAULT DETECTION (VTT)
PGOOD2 Upper Trip Threshold
PGOOD2 Lower Trip Threshold
Hysteresis = 25mV
Hysteresis = 25mV
8
10
13
%
-13
-10
-8
%
PGOOD2 Propagation Delay
tPGOOD2
VTTS forced 50mV beyond PGOOD2
trip threshold
10
μs
PGOOD2 Fault Latch Delay
VTTS forced 50mV beyond PGOOD2
trip threshold
5
ms
PGOOD2 Output Low Voltage
ISINK = 3mA
0.4
V
PGOOD2 Leakage Current
IPGOOD2
VTTS = VREFIN (PGOOD2 high impedance),
PGOOD2 forced to 5V, TA = +25°C
1
μA
FAULT DETECTION
Thermal-Shutdown Threshold
TSHDN Hysteresis = 15°C
160
°C
VCC Undervoltage Lockout
Threshold
VUVLO(VCC)
Rising edge, IC disabled below this level
hysteresis = 200mV
3.8
4.1
4.4
V
CSL Discharge MOSFET
OVP = VCC
16
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