MPC7447A 查看數據表（PDF） - Freescale Semiconductor

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MPC7447A

RISC Microprocessor Hardware Specifications

Freescale Semiconductor 

Electrical and Thermal Characteristics

Table 3. Input Threshold Voltage Settings

BVSEL Signal

Processor Bus Input Threshold is Relative to:

Notes

0

1.8 V

1, 2

¬HRESET

Not available

1

HRESET

2.5 V

1

1

2.5 V

1

Notes:

1. Caution: The input threshold selection must agree with the OVDD voltages supplied. See notes in Table 2.

2. If used, pull-down resistors should be less than 250 Ω.

Table 4 provides the recommended operating conditions for the MPC7447A.

NOTE

Table 4 describes the nominal operating conditions of the device. For

information regarding the operation of the device at supported derated core

voltage conditions, see Section 5.3, “Voltage and Frequency Derating.”

Table 4. Recommended Operating Conditions1

Characteristic

Recommended Value

Symbol

Unit Notes

Minimum Maximum

Core supply voltage

VDD

1.3 V ± 50 mV

V

3

PLL supply voltage

AVDD

1.3 V ± 50 mV

V

2, 3

Processor bus supply voltage BVSEL = 0

OVDD

1.8 V ± 5%

V

BVSEL = HRESET or OVDD OVDD

2.5 V ± 5%

Input voltage

Processor bus

Vin

GND

OVDD

V

JTAG signals

Vin

GND

OVDD

Die-junction temperature

Tj

0

105

°C

Notes:

1. These are the recommended and tested operating conditions. In addition, these devices also support voltage

derating; see Section 5.3, “Voltage and Frequency Derating.” Proper device operation outside of these conditions

and those specified in Section 5.3 is not guaranteed.

2. This voltage is the input to the filter discussed in Section 9.2, “PLL Power Supply Filtering,” and not necessarily the

voltage at the AVDD pin, which may be reduced from VDD by the filter.

3. VDD and AVDD may be reduced in order to reduce power consumption if further maximum core frequency

constraints are observed. See Section 5.3, “Voltage and Frequency Derating,” for specific information.

Table 5 provides the package thermal characteristics for the MPC7447A.

Table 5. Package Thermal Characteristics1

Characteristic

Junction-to-ambient thermal resistance, natural convection, single-layer (1s) board

Junction-to-ambient thermal resistance, natural convection, four-layer (2s2p) board

Junction-to-ambient thermal resistance, 200 ft/min airflow, single-layer (1s) board

Symbol

RθJA

RθJMA

RθJMA

Value

26

19

20

Unit

°C/W

°C/W

°C/W

Notes

2, 3

2, 4

2, 4

MPC7447A RISC Microprocessor Hardware Specifications, Rev. 5

Freescale Semiconductor

11

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