AD9142 查看數據表（PDF） - Analog Devices

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AD9142

Dual, 16-Bit, 1600 MSPS, TxDAC+ Digital-to-Analog Converter

Analog Devices 

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 7.

Parameter

AVDD33 to AVSS, EPAD, CVSS, DVSS

DVDD18, CVDD18 to AVSS, EPAD,

CVSS, DVSS

AVSS to EPAD, CVSS, DVSS

EPAD to AVSS, CVSS, DVSS

CVSS to AVSS, EPAD, DVSS

DVSS to AVSS, EPAD, CVSS

FSADJ, REFIO, IOUT1P/IOUT1N,

IOUT2P/IOUT2N to AVSS

D[15:0]P/D[15:0]N, FRAMEP/FRAMEN,

DCIP/DCIN to EPAD, DVSS

DACCLKP/DACCLKN,

REFP/SYNCP/REFN/SYNCN to CVSS

RESET, IRQ1, IRQ2, CS, SCLK, SDIO

to EPAD, DVSS

Junction Temperature

Storage Temperature Range

Rating

−0.3 V to +3.6 V

−0.3 V to +2.1 V

−0.3 V to +0.3 V

−0.3 V to +0.3 V

−0.3 V to +0.3 V

−0.3 V to +0.3 V

−0.3 V to AVDD33 + 0.3 V

−0.3 V to DVDD18 + 0.3 V

−0.3 V to CVDD18 + 0.3 V

−0.3 V to DVDD18 + 0.3 V

125°C

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

AD9142

THERMAL RESISTANCE

The exposed pad (EPAD) must be soldered to the ground plane

(AVSS) for the 72-lead LFCSP. The EPAD provides an electrical,

thermal, and mechanical connection to the board.

Typical θJA, θJB, and θJC values are specified for a 4-layer board in

still air. Airflow increases heat dissipation, effectively reducing

θJA and θJB.

Table 8. Thermal Resistance

Package

θJA

θJB

θJC

72-Lead LFCSP 20.7 10.9 1.1

Unit Conditions

°C/W EPAD soldered

to ground plane

ESD CAUTION

Rev. 0 | Page 9 of 64

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