ADF4113HVBCPZ-RL7(Rev0) 查看數據表（PDF） - Analog Devices

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ADF4113HVBCPZ-RL7
(Rev.:Rev0)

High Voltage Charge Pump, PLL Synthesizer

Analog Devices 

ADF4113HV

ADSP-21xx Interface

Figure 25 shows the interface between the ADF4113HV and the

ADSP-21xx digital signal processor. The ADF4113HV needs a

24-bit serial word for each latch write. The easiest way to

accomplish this using the ADSP-21xx family is to use the auto

buffered transmit mode of operation with alternate framing.

This provides a means for transmitting an entire block of serial

data before an interrupt is generated.

SCLK

ADSP-21xx

DT

TFS

I/O FLAGS

CLK

DATA

LE ADF4113HV

CE

MUXOUT

(LOCK DETECT)

Figure 25. ADSP-21xx to ADF4113HV Interface

Set up the word length for eight bits and use three memory

locations for each 24-bit word. To program each 24-bit latch,

store the three 8-bit bytes, enable the auto buffered mode, and

then write to the transmit register of the DSP. This last opera-

tion initiates the autobuffer transfer.

PCB DESIGN GUIDELINES FOR CHIP SCALE

PACKAGE

The lands on the chip scale package (CP-20-1) are rectangular.

The printed circuit board pad for these should be 0.1 mm

longer than the package land length, and 0.05 mm wider than

the package land width. The land should be centered on the pad

to ensure that the solder joint size is maximized.

The bottom of the chip scale package has a central thermal pad.

The thermal pad on the printed circuit board should be at least

as large as this exposed pad. On the printed circuit board, provide

a clearance of at least 0.25 mm between the thermal pad and the

inner edges of the pad pattern. This ensures that shorting is

avoided.

Thermal vias can be used on the printed circuit board thermal

pad to improve thermal performance of the package. If vias are

used, they should be incorporated in the thermal pad at a 1.2 mm

pitch grid. The via diameter should be between 0.3 mm and

0.33 mm, and the via barrel should be plated with 1 oz. copper

to plug the via.

The user should connect the printed circuit board thermal pad

to AGND.

Rev. 0 | Page 16 of 20

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