ADF4113HVBCPZ-RL7(Rev0) 查看數據表（PDF） - Analog Devices
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ADF4113HVBCPZ-RL7 Datasheet PDF : 20 Pages
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OUTLINE DIMENSIONS
4.00
BSC SQ
PIN 1
INDICATOR
TOP
VIEW
3.75
BCS SQ
0.60
MAX
0.60
MAX
16
15
PIN 1
INDICATOR
20 1
12° MAX
1.00
0.85
0.80
SEATING
PLANE
0.50
BSC
0.80 MAX
0.65 TYP
0.20
REF
0.75
0.55
0.35
0.05 MAX
0.02 NOM
11
5
10
6
0.30
0.23
0.18
COPLANARITY
0.08
2.25
2.10 SQ
1.95
0.25 MIN
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
Figure 26. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm x 4 mm Body, Very Thin Quad
(CP-20-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADF4113HVBRUZ1
ADF4113HVBRUZ-RL1
ADF4113HVBRUZ-RL71
ADF4113HVBCPZ1
ADF4113HVBCPZ-RL1
ADF4113HVBCPZ-RL71
EVAL-ADF4113HVEB1Z1
1 Z = Pb-free part.
5.10
5.00
4.90
16
9
4.50
4.40
4.30
1
6.40
BSC
8
PIN 1
1.20
0.15
MAX
0.20
0.05
0.09
0.75
0.30
8°
0.60
0.65
BSC
0.19 SEATING
PLANE
0°
0.45
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 27. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Evaluation Board
ADF4113HV
Package Option
RU-16
RU-16
RU-16
CP-20-1
CP-20-1
CP-20-1
Rev. 0 | Page 17 of 20
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