ADM1067ASU-REEL 查看數據表（PDF） - Analog Devices

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ADM1067ASU-REEL

Super Sequencer® with Open-Loop Margining DACs

Analog Devices 

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Voltage on VH Pin

Voltage on VPn Pins

Voltage on VXn Pins

Voltage on A0, A1 Pins

Voltage on REFOUT Pin

Voltage on VDDCAP, VCCP Pins

Voltage on DACn Pins

Voltage on PDOn Pins

Voltage on SDA, SCL Pins

Voltage on GND, AGND, PDOGND, REFGND Pins

Voltage on MUP and MDN Pins

Input Current at Any Pin

Package Input Current

Maximum Junction Temperature (TJ max)

Storage Temperature Range

Lead Temperature

Soldering Vapor Phase, 60 sec

ESD Rating, All Pins

Rating

16 V

7V

−0.3 V to +6.5 V

−0.3 V to +7 V

5V

6.5 V

6.5 V

16 V

7V

−0.3 V to +0.3 V

VDDCAP + 0.6 V

±5 mA

±20 mA

150°C

−65°C to +150°C

215°C

2000 V

ADM1067

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

θJA

40-Lead LFCSP

25

48-Lead TQFP

50

Unit

°C/W

°C/W

ESD CAUTION

Rev. B | Page 9 of 32

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