CXA1870 查看數據表（PDF） - Sony Semiconductor

零件编号

产品描述 (功能)

生产厂家

CXA1870

Color TV Y/C/Jungle

Sony Semiconductor 

Package Outline Unit : mm

CXA1870S

42PIN SDIP (PLASTIC)

+ 0.4

37.8 – 0.1

42

22

1

21

1.778

0° to 15°

0.5 ± 0.1

0.9 ± 0.15

Two kinds of package surface:

1.All mat surface type.

2.Center part is mirror surface.

SONY CODE

EIAJ CODE

JEDEC CODE

SDIP-42P-02

SDIP042-P-0600

PACKAGE STRUCTURE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

SOLDER PLATING

42/COPPER ALLOY

4.4g

—40—

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