MAAP-000072-MCH000 查看數據表（PDF） - Tyco Electronics
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MAAP-000072-MCH000 Datasheet PDF : 8 Pages
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Amplifier, Power, 1 W
17.7-19.7 GHz
Mechanical Information
Chip Size: 3.150 x 2.000 x 0.075 mm (124 x 79 x 3 mils)
MAAPGM0072-DIE
Rev B
Preliminary Datasheet
Chip edge to bond pad dimensions are shown to the center of the bond pad.
Figure 23. Die Layout
Bond Pad Dimensions
Pad
RF In and Out
DC Drain Supply Voltage VDD
DC Gate Supply Voltage VGG
7
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Size (μm)
100 x 200
200 x 150
150 x 150
Size (mils)
4x8
8x6
6x6
• North America Tel: 800.366.2266 / Fax: 978.366.2266
• Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
• Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.
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