MS81V04166 查看數據表（PDF） - Oki Electric Industry

零件编号

产品描述 (功能)

生产厂家

MS81V04166

Dual FIFO (262,214 Words ×8 Bits) × 2

Oki Electric Industry 

1Semiconductor

PACKAGE DIMENSIONS

TQFP100-P-1414-0.50-K

PEDS81V04166-01

MS81V04166

(Unit: mm)

Mirror finish

5

Package material

Lead frame material

Pin treatment

Package weight (g)

Rev. No./Last Revised

Epoxy resin

42 alloy

Solder plating (≥5µm)

0.55 TYP.

4/Oct. 28, 1996

Notes for Mounting the Surface Mount Type Package

The surface mount type packages are very susceptible to heat in reflow mounting and humidity

absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product

name, package name, pin number, package code and desired mounting conditions (reflow method,

temperature and times).

18/19

Share Link: