µPD16879
ABSOLUTE MAXIMUM RATINGS (TA = +25°C)
When mounted on a glass epoxy board (100 mm × 100 mm × 1 mm, 15% copper foil)
Parameter
Symbol
Conditions
Rating
Supply voltage
VDD
Control part
–0.5 to +6.0
VM
Output part
–0.5 to +11.2
Input voltage
VIN
–0.5 to VDD + 0.5
Reference voltage
VREF
External input
0.5
H bridge drive current
IM(DC)
DC
±0.15
IM(pulse) PW < 10 ms, Duty < 5 %
±0.3
Power consumption
PT
1.0
Peak junction temperature
TCH(MAX)
150
Storage temperature
Tstg
–55 ∼ +150
Unit
V
V
V
V
A/ch
A/ch
W
°C
°C
RECOMMENDED OPERATING RANGE (TA = +25°C)
When mounted on a glass epoxy board (100 mm × 100 mm × 1 mm, 15% copper foil)
Parameter
Symbol
Conditions
MIN. TYP.
Supply voltage
VDD
Control part
2.7
VM
Output part
4.0
Input voltage
VIN
0
Reference voltage
VREF
External input
225
250
EXP pin input voltage
VEXPIN
EXP pin input current
IEXPIN
H bridge drive current
IM(DC)
DC
−0.1
IM(pulse) PW < 10 ms, Duty < 5%
−0.2
Clock frequency (OSCIN)
Clock frequency amplitude
fCLK
VfCLK
COSC = 68 pF, VREF = 250 mV
3.9
4.5
0.7 × VDD
Serial clock frequency
fSCLK
Video sync signal width
PW(VD) fCLK = 4.5 MHz
250
LATCH signal wait time
t(VD-LATCH) Refer to Fig. 1
400
SCLK wait time
t(SCLK-LATCH)
400
SDATA setup time
tsetup
80
SDATA hold time
thold
80
Reset signal pulse width
tRST
100
Operating temperautre
TA
−10
Peak junction temperature
TCH(MAX)
MAX.
5.5
11
VDD
275
VDD
100
+0.1
+0.2
6.0
VDD
5.0
85
125
Unit
V
V
V
mV
V
µA
A/ch
A/ch
MHz
V
MHz
ns
ns
ns
ns
ns
µs
°C
°C
2
Data Sheet S14188EJ1V0DS00