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UPD161831 查看數據表(PDF) - NEC => Renesas Technology

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UPD161831 Datasheet PDF : 67 Pages
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2. PIN CONFIGURATION (Pad Layout)
Chip size: T.B.D.
Bump size: INPUT/VCOM/TEST/DUMMY: 50 x 75 µm2
OUTPUT: 35 x 100 µm2
Remark T.B.D.: To be determined.
Alignment Mark (Unit: µm)
X Coordinate Y Coordinate
Alignment1 Aluminum (core)
10768.0
441.0
Alignment2
Bump (core)
Aluminum (core)
Bump (core)
10768.0
10768.0
10768.0
366.0
441.0
366.0
Remark The figures are rounded off in 0.5 µm units.
Alignment2
Driver output side
Input/output side
50 µm
50 µm
50 µm
50 µm
µPD161831
Alignment1
Alminum
Bump
Preliminary Product Information S16269EJ2V0PM
3

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