VSC835UB 查看數據表（PDF） - Vitesse Semiconductor

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VSC835UB

2.5 Gbits/sec 34x34 Crosspoint Switch with Signal Detection

Vitesse Semiconductor 

VITESSE

SEMICONDUCTOR CORPORATION

2.5 Gbits/sec

34x34 Crosspoint Switch with Signal Detection

Datasheet

VSC835

Package Pin Descriptions

The VSC835 is packaged in a 27x27mm 256 pin ball grid array package. The 256 BGA package is ther-

mally enhanced and carries the high-speed signals over controlled impedance lines from the solder ball to the

circuit die. The following sections describe the pinout and mechanical details of the VSC835.

Figure 6: Functional Pinout Floorplan

A0 A2 A4

A32

I/P LOS and termination

34:1 Switch slice

Y0

Y1

34:1 Switch slice

34:1 Switch slice

Y2

Y3

34:1 Switch slice

Y31

34:1 Switch slice

34:1 Switch slice

Y32

Y33

34:1 Switch slice

I/P LOS and termination

control logic

A1 A3 A5

A33

Programming

interface

Page 10

© VITESSE SEMICONDUCTOR CORPORATION

741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896

G52270-0, Rev. 4.1

7/24/00

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