VSC8114QB 查看數據表（PDF） - Vitesse Semiconductor

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VSC8114QB

ATM/SONET/SDH 622 Mb/s Transceiver Mux/Demux with Integrated Clock Generation and Clock Recovery

Vitesse Semiconductor 

VITESSE

SEMICONDUCTOR CORPORATION

ATM/SONET/SDH 622 Mb/s Transceiver Mux/Demux

with Integrated Clock Generation and Clock Recovery

Data Sheet

VSC8114

The VSC8114 is manufactured in a 100PQFP package which is supplied by two different vendors. The crit-

ical dimensions in the drawing represent the superset of dimensions for both packages. The significant differ-

ence between the two packages is in the shape and size of the heatspreader which needs to be considered when

attaching a heatsink.

Package Thermal Characteristics

The VSC8114 is packaged in a thermally enhanced 100PQFP with an embedded heat sink. The heat sink

surface configurations are shown in the package drawings. With natural convection, the case to air thermal resis-

tance is estimated to be 27.5oC/W. The air flow versus thermal resistance relationship is shown in Table 14.

Junction to case thermal resistance is 1.2 oC/W

Table 14: Theta Case to Ambient versus Air Velocity

Air Velocity

(LFPM)

0

100

200

400

600

Case to air thermal resistance

oC/W

27.5

23.1

19.8

17.6

16

Page 18

© VITESSE SEMICONDUCTOR CORPORATION

G52185-0, Rev 4.0

741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896

11/1/99

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