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VSC8132QR 查看數據表(PDF) - Vitesse Semiconductor

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VSC8132QR
Vitesse
Vitesse Semiconductor Vitesse
VSC8132QR Datasheet PDF : 14 Pages
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VITESSE
SEMICONDUCTOR CORPORATION
2.488Gb/s 1:32 SONET/SDH Demux
Preliminary Data Sheet
VSC8132
Decoupling of the power supplies is a critical element in maintaining the proper operation of the part. It is
recommended that the VCC power supply be decoupled using a 0.1µF and 0.01µF capacitor placed in parallel
on each VCC power supply pin as close to the package as possible. If room permits, a 0.001µF capacitor should
also be placed in parallel with the 0.1µF and 0.01µF capacitors mentioned above. Recommended capacitors are
low-inductance ceramic SMT X7R devices. For the 0.1µF capacitor, a 0603 package should be used. The
0.01µF and 0.001µF capacitors can be either 0603 or 0402 packages.
For low frequency decoupling, 47µF tantalum, low-inductance SMT caps should be sprinkled over the
board’s main +3.3V power supply and placed close to the C-L-C pi filter.
If the device is being used in an ECL environment with a -3.3V supply, all references to decoupling VCC
must be changed to VEE, and all references to decoupling 3.3V must be changed to -3.3V.
AC Characteristics
Figure 2: Output Timing
tPD1
tPD2
78MHz CLK
78MHz DATA
SYNC PULSE
PARITY
Figure 3: Data Output Timing
tSERSU
tSERHO
DI+
Differential Serial Data Input
D31
D0
MSB
LSB
Time
CLKI+
Differential Clock Input
NOTE: Bit 31 (MSB) is received first, Bit 0 (LSB) is received last.
Page 4
© VITESSE SEMICONDUCTOR CORPORATION 741 Calle Plano Camarillo, CA 93012
Tel: (800) VITESSE FAX: (805) 987-5896 Email: prodinfo@vitesse.com
Internet: www.vitesse.com
G52250-0, Rev 3.1
12/7/00

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