DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

HDMP-1512 查看數據表(PDF) - HP => Agilent Technologies

零件编号
产品描述 (功能)
生产厂家
HDMP-1512
HP
HP => Agilent Technologies HP
HDMP-1512 Datasheet PDF : 26 Pages
First Prev 11 12 13 14 15 16 17 18 19 20 Next Last
Package Description
and Assembly
Recommendations
The HDMP-1512 and HDMP-
1514 are available in the industry
standard M-Quad 80 lead
package. The outline dimensions
conform to JEDEC plastic QFP
specifications and are shown in
Figure 13. The package material
is aluminum. To facilitate surface
mounting, the leads have been
formed into a “GullWing” config-
uration. We recommend keeping
the package temperature, TC,
below 85°C. Forced air cooling
may be required.
M-Quad 80 Package Specifications
Item
Package Material
Lead Finish Material
Lead Finish Thickness
Lead Coplanarity
Specification
Aluminum
85/15 Sn/Pb
300-600 µinches
0.004 inches maximum
PIN #1 ID
23.20 ± 0.10
(0.913 ± 0.004)
TOP VIEW
13.792
+
-
0.16
0.04
( ) 0.543
+
-
0.008
0.002
17.20 ± 0.10
(0.677 ± 0.004)
+ 0.18
19.786 - 0.08
( ) 0.779
+
-
0.008
0.002
0.35 TYP.
(0.014 )
0.80 TYP.
(0.0315 )
2.64 ± 0.13
(0.104 ± 0.005)
ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).
Figure 13. HDMP-1512 and HDMP-1514 Package Outline.
0.15
(0.006)
0.80 ± 0.13
(0.031 ± 0.005)
0.38 ± 0.05
(0.015 ± 0.002)
675

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]