AD7249(2000) 查看數據表（PDF） - Analog Devices
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AD7249 Datasheet PDF : 12 Pages
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AD7249
TIMING CHARACTERISTICS1, 2 (VDD = +12 V to +15 V,3 VSS = 0 V or –12 V to –15 V,3 AGND = DGND = 0 V, RL = 2 k⍀,
CL = 100 pF. All specifications TMIN to TMAX unless otherwise noted.)
Parameter
Limit at TMIN to TMAX
(All Versions)
Unit
Conditions/Comments
t14
200
t2
15
t3
50
t4
0
t5
150
t6
0
t7
20
t8
0
t9
50
t10
20
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
SCLK Cycle Time
SYNC to SCLK Falling Edge Setup Time
SYNC to SCLK Hold Time
Data Setup Time
Data Hold Time
SYNC High to LDAC Low
LDAC Pulsewidth
LDAC High to SYNC Low
CLR Pulsewidth
SYNC High Time
NOTES
1Timing specifications guaranteed by design not production tested. All input signals are specified with tr = tf = 5 ns (10% to 90% of 5 V) and timed from a voltage
level of 1.6 V.
2See Figure 8.
3Power supply tolerance, A Version: ± 10%; B, S Versions: ± 5%.
4SCLK Mark/Space Ratio range is 45/55 to 55/45.
ABSOLUTE MAXIMUM RATINGS1
(TA = +25°C unless otherwise noted)
VDD to AGND, DGND . . . . . . . . . . . . . . . . . . –0.3 V to +17 V
VSS to AGND, DGND . . . . . . . . . . . . . . . . . . +0.3 V to –17 V
AGND to DGND . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
VOUTA,
2
B
to
AGND
............
VSS – 0.3 V to VDD + 0.3 V
REFOUT to AGND . . . . . . . . . . . . . . . . . . . . . . . . 0 V to VDD
REFIN to AGND . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Digital Inputs to DGND . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (A, B Versions) . . . . . . . . . . . . . . –40°C to +85°C
Extended (S Version) . . . . . . . . . . . . . . . . . –55°C to +125°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Power Dissipation Plastic DIP . . . . . . . . . . . . . . . . . . . 600 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . +117°C/W
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . +300°C
Power Dissipation, Cerdip . . . . . . . . . . . . . . . . . . . . . . 600 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 76°C/W
Lead Temperature (Soldering, 10 secs) . . . . . . . . . . +300°C
Power Dissipation, SOIC . . . . . . . . . . . . . . . . . . . . . . . 600 mW
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature (Soldering)
Vapor Phase (60 secs) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 secs) . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one Absolute
Maximum Rating may be applied at any time.
2The outputs may be shorted to voltages in this range provided the power dissipation
of the package is not exceeded.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7249 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. C
–3–
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