FSA839UCX 查看數據表（PDF） - Fairchild Semiconductor
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FSA839UCX Datasheet PDF : 10 Pages
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Physical Dimensions
BALL A1
INDEX AREA
0.03 C
2X
F
E
A
B
DF
0.03 C
2X
TOP VIEW
SOLDER MASK
OPENING
A1
(R0.15)
0.40
(Ø0.20)
Cu Pad
(1.10)
0.40
(0.70)
RECOMMENDED LAND PATTERN (NSMD)
0.05 C
0.06 C
0.625
0.547
E
0.378±0.018
0.208±0.021
C
SEATING PLANE
D
SIDE VIEWS
0.40
C
B
0.40
A
12
Ø0.260±0.010
6X
0.005 C A B
(Y) +/-0.018
F
(X) +/-0.018
BOTTOM VIEW
NOTES:
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASMEY14.5M, 1994.
D. DATUM C, THE SEATING PLANE IS DEFINED
BY THE SPHERICAL CROWNS OF THE BALLS.
E. PACKAGE TYPICAL HEIGHT IS 586 MICRONS
±39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
G. BALL COMPOSITION: Sn95.5-Ag3.9-Cu0.6.
H. DRAWING FILENAME: UC006ACrev2.
Figure 12. 6-Ball, WLCSP 0.4mm Pitch
Table 1. Product Specific Dimensions
Product
FSA839UCX
D
1.160
E
0.760
X
0.180
Y
0.180
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2008 Fairchild Semiconductor Corporation
FSA839 • Rev. 1.0.0
9
www.fairchildsemi.com
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