MCF5271CVM150 查看數據表（PDF） - Freescale Semiconductor
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MCF5271CVM150 Datasheet PDF : 42 Pages
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Mechanicals/Pinouts and Part Numbers
6.4 Package Dimensions—160 QFP
Figure 6 shows MCF5270/71CAB80 package dimensions.
Y
L
–A–, –B–, –D–
–A–
L
–B–
B
V
BB
DETAIL A
P
G
DETAIL A
Z
A
0.20 (0.008) M C A-B S D S
0.20 (0.008) A-B
S
0.20 (0.008) M C A-B S D S
DETAIL C
–H–
BASE
METAL
N
J
F
D
0.13 (0.005) M C A-B S D S
SECTION B–B
C E –H–
–C–
H
0.110 (0.004)
DETAIL C
M×
TOP &
BOTTOM
U×
W
K
X
NOTES
1. DIMENSIONING AND TOLERINCING PER ANSI
Y14.5M, 1982.
T
2. CONTROLLING DIMENSION: MILLIMETER
3. DATUM PLAN -H- IS LOCATED AT BOTTOM OF
R
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
Q×
4. DATUMS -A-, -B-, AND -D- TO BE DETERMINED AT
DATUM PLANE -H-.
5. DIMENSIONS S AND V TO BE DETERMINED AT
SEATING PLANE -C-.
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE -H-.
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
Case 864A-03
MILLIMETERS INCHES
DIM MIN MAX MIN MAX
A 27.90 28.10 1.098 1.106
B 27.90 28.10 1.098 1.106
C 3.35 3.85 0.132 1.106
D 0.22 0.38 0.009 0.015
E 3.20 3.50 0.126 0.138
F 0.22 0.33 0.009 0.013
G 0.65 BSC
0.026 REF
H 0.25 0.35 0.010 0.014
J 0.11 0.23 0.004 0.009
K 0.70 0.90 0.028 0.035
L 25.35 BSC
M
5° 16°
0.998 REF
5° 16°
N 0.11 0.19 0.004 0.007
P 0.325 BSC 0.013 REF
Q
0° 7°
0°
7°
R 0.13 0.30 0.005 0.012
S 31.00 31.40 1.220 1.236
T 0.13 — 0.005 —
U
0°
—
0°
—
V 31.00 31.40 1.220 1.236
W 0.4 — 0.016 —
X 1.60 REF
0.063 REF
Y 1.33 REF
0.052 REF
Z 1.33 REF
0.052 REF
Figure 6. 160 QFP Package Dimensions
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 4
16
Freescale Semiconductor
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