Electrical Characteristics
TA= Ambient Temperature, °C
ΘJMA= Package Thermal Resistance, Junction-to-Ambient, °C/W
PD= PINT + PI/O
PINT= IDD × VDD, Watts - Chip Internal Power
PI/O= Power Dissipation on Input and Output Pins — User Determined
For most applications PI/O < PINT and can be ignored. An approximate relationship between PD
and TJ (if PI/O is neglected) is:
PD = K ÷ (TJ + 273°C) (2)
Solving equations 1 and 2 for K gives:
K = PD × (TA + 273 °C) + ΘJMA × PD 2 (3)
where K is a constant pertaining to the particular part. K can be determined from equation (3)
by measuring PD (at equilibrium) for a known TA. Using this value of K, the values of PD and
TJ can be obtained by solving equations (1) and (2) iteratively for any value of TA.
7.3 DC Electrical Specifications
Table 9. DC Electrical Specifications1
Characteristic
Core Supply Voltage
Pad Supply Voltage
PLL Supply Voltage
Input High Voltage
Input Low Voltage
Input Hysteresis
Input Leakage Current
Vin = VDD or VSS, Input-only pins
High Impedance (Off-State) Leakage Current
Vin = VDD or VSS, All input/output and output pins
Output High Voltage (All input/output and all output pins)
IOH = –5.0 mA
Output Low Voltage (All input/output and all output pins)
IOL = 5.0mA
Weak Internal Pull Up Device Current, tested at VIL Max.2
Input Capacitance 3
All input-only pins
All input/output (three-state) pins
Symbol
Min
VDD
OVDD
VDDPLL
VIH
VIL
VHYS
Iin
1.4
3.0
3.0
0.7 × OVDD
VSS – 0.3
0.06 × OVDD
–1.0
IOZ
–1.0
VOH
OVDD - 0.5
VOL
—
IAPU
–10
Cin
—
—
Typical
—
—
—
—
—
—
—
—
—
—
—
—
Max
Unit
1.6
V
3.6
V
3.6
V
3.65
V
0.35 × OVDD V
—
mV
1.0
μA
1.0
μA
—
V
0.5
V
– 130
μA
pF
7
7
MCF5271 Integrated Microprocessor Hardware Specification, Rev. 4
Freescale Semiconductor
19