MCF5271CVM150 查看數據表（PDF） - Freescale Semiconductor

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MCF5271CVM150

Integrated Microprocessor Hardware Specification

Freescale Semiconductor 

Electrical Characteristics

Table 9. DC Electrical Specifications1 (continued)

Characteristic

Symbol

Min

Typical

Max

Unit

Load Capacitance4

Low drive strength

High drive strength

Core Operating Supply Current 5

Master Mode

CL

IDD

—

—

25

pF

—

50

pF

135

150

mA

Pad Operating Supply Current

Master Mode

Low Power Modes

OIDD

—

—

100

TBD

—

mA

—

μA

DC Injection Current 3, 6, 7, 8

IIC

VNEGCLAMP =VSS– 0.3 V, VPOSCLAMP = VDD + 0.3

Single Pin Limit

Total processor Limit, Includes sum of all stressed pins

–1.0

–10

1.0

mA

10

mA

1 Refer to Table 10 for additional PLL specifications.

2 Refer to the MCF5271 signals section for pins having weak internal pull-up devices.

3 This parameter is characterized before qualification rather than 100% tested.

4 pF load ratings are based on DC loading and are provided as an indication of driver strength. High speed interfaces require

transmission line analysis to determine proper drive strength and termination. See High Speed Signal Propagation:

Advanced Black Magic by Howard W. Johnson for design guidelines.

5 Current measured at maximum system clock frequency, all modules active, and default drive strength with matching load.

6 All functional non-supply pins are internally clamped to VSS and their respective VDD.

7 Input must be current limited to the value specified. To determine the value of the required current-limiting resistor, calculate

resistance values for positive and negative clamp voltages, then use the larger of the two values.

8 Power supply must maintain regulation within operating VDD range during instantaneous and operating maximum current

conditions. If positive injection current (Vin > VDD) is greater than IDD, the injection current may flow out of VDD and could

result in external power supply going out of regulation. Insure external VDD load will shunt current greater than maximum

injection current. This will be the greatest risk when the processor is not consuming power. Examples are: if no system

clock is present, or if clock rate is very low which would reduce overall power consumption. Also, at power-up, system clock

is not present during the power-up sequence until the PLL has attained lock.

7.4 Oscillator and PLLMRFM Electrical Characteristics

Table 10. HiP7 PLLMRFM Electrical Specifications1

Num

Characteristic

1 PLL Reference Frequency Range

Crystal reference

External reference

1:1 mode (NOTE: fsys/2 = 2 × fref_1:1)

2 Core frequency

CLKOUT Frequency 2

External reference

On-Chip PLL Frequency

3 Loss of Reference Frequency 3, 5

4 Self Clocked Mode Frequency 4, 5

5 Crystal Start-up Time 5, 6

Symbol

Min.

Value

fref_crystal

fref_ext

fref_1:1

fsys

fsys/2

fLOR

fSCM

tcst

8

8

24

0

fref ÷ 32

100

10.25

—

Max.

Value

25

25

75

150

75

75

1000

15.25

10

Unit

MHz

MHz

MHz

MHz

kHz

MHz

ms

MCF5271 Integrated Microprocessor Hardware Specification, Rev. 4

20

Freescale Semiconductor

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