ISL85410 查看數據表（PDF） - Renesas Electronics
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ISL85410 Datasheet PDF : 21 Pages
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ISL85410
Layout Considerations
Proper layout of the power converter will minimize EMI and noise
and insure first pass success of the design. PCB layouts are
provided in multiple formats on the Intersil web site. In addition,
Figure 50 will make clear the important points in PCB layout. In
reality, PCB layout of the ISL85410 is quite simple.
A multilayer printed circuit board with GND plane is
recommended. Figure 50 shows the connections of the critical
components in the converter. Note that capacitors CIN and COUT
could each represent multiple physical capacitors. The most
critical connections are to tie the PGND pin to the package GND
pad and then use vias to directly connect the GND pad to the
system GND plane. This connection of the GND pad to system
plane insures a low impedance path for all return current, as well
as an excellent thermal path to dissipate heat. With this
connection made, place the high frequency MLCC input capacitor
near the VIN pin and use vias directly at the capacitor pad to tie
the capacitor to the system GND plane.
The boot capacitor is easily placed on the PCB side opposite the
controller IC and 2 vias directly connect the capacitor to BOOT
and PHASE.
Place a 1µF MLCC near the VCC pin and directly connect its
return with a via to the system GND plane.
Place the feedback divider close to the FB pin and do not route
any feedback components near PHASE or BOOT. If external
components are used for SS, COMP or FS the same advice
applies.
CCSSS RRFFSS
CVCVININ
LL11
COCOUUTT
0.47”
FIGURE 50. PRINTED CIRCUIT BOARD POWER PLANES AND ISLANDS
FN8375 Rev 7.00
March 13, 2015
Page 19 of 21
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