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MCP23016 查看數據表(PDF) - Microchip Technology

零件编号
产品描述 (功能)
生产厂家
MCP23016
Microchip
Microchip Technology Microchip
MCP23016 Datasheet PDF : 38 Pages
First Prev 21 22 23 24 25 26 27 28 29 30 Next Last
3.0 PACKAGE INFORMATION
3.1 Package Marking Information
28-Lead PDIP (Skinny DIP)
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
28-Lead SOIC
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
XXXXXXXXXXXXXXXXX
YYWWNNN
28-Lead SSOP
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
28-Lead QFN
XXXXXXXX
XXXXXXXX
YYWWNNN
MCP23016
Example:
MCP23016-I/SP e3
0717017
Example:
MCP23016-I/SO e3
0710017
Example:
MCP23016
-I/SS e3
0720017
Example:
MCP23016
-I/ML e3
0710017
Legend:
XX...X
Y
YY
WW
NNN
*e3
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
e3
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2007 Microchip Technology Inc.
DS20090C-page 27

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