MCP23016 查看數據表（PDF） - Microchip Technology

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MCP23016

16-Bit I2C™ I/O Expander

Microchip Technology 

MCP23016

28-Lead Skinny Plastic Dual In-Line (SP) – 300 mil Body [SPDIP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

N

NOTE 1

1 23

D

A

A1

b1

b

E1

A2

L

e

E

c

eB

Units

INCHES

Dimension Limits MIN

NOM

MAX

Number of Pins

N

28

Pitch

e

.100 BSC

Top to Seating Plane

A

–

–

.200

Molded Package Thickness

A2

.120

.135

.150

Base to Seating Plane

A1

.015

–

–

Shoulder to Shoulder Width

E

.290

.310

.335

Molded Package Width

E1

.240

.285

.295

Overall Length

D

1.345

1.365

1.400

Tip to Seating Plane

L

.110

.130

.150

Lead Thickness

c

.008

.010

.015

Upper Lead Width

b1

.040

.050

.070

Lower Lead Width

b

.014

.018

.022

Overall Row Spacing §

eB

–

–

.430

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. § Significant Characteristic.

3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.

4. Dimensioning and tolerancing per ASME Y14.5M.

DS20090C-page 28

© 2007 Microchip Technology Inc.

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